Wafer Map & Region Split

Wafer Map Analysis and Region Split Analysis

Divide wafers into multiple regions and review yield, defect category rates, and measurement data statistics by region. This supports identification of local anomalies and process abnormalities.

Wafer control chart screen. — Wafer control chart: review statistics after region splitting using upper and lower graphs

Diagram explaining wafer region split methods. — Region split methods: four split methods and examples of yield, category, and statistic aggregation

Example display of area split map and PF map. — Area split map and PF map: visualize yield and pass/fail distribution by area

Example display of category map and value map. — Category map and value map: display chip-level categories and specified test item values

10-Segment / 16-Segment Splitting

Divide wafers into multiple regions and compare yield and statistics by region. This makes it easier to understand differences between center, edge, and local areas.

Target Data

Yield, defect category rates, measurement data mean, median, IQR, standard deviation, and other statistics can be aggregated.

Anomaly Drill-Down

When anomalies are suspected, drill down to chip level using category maps and value maps, then proceed to detailed analysis.

Use

Analysis optimized for detecting spatial bias

Wafer maps and statistical analysis are integrated to identify partial defects within wafers, edge-related issues, and local anomalies caused by equipment or process conditions.

View anomaly detection algorithms