Semiconductor Test Data Analysis Platform

Semiconductor Test Data Analysis Tool
KAI_Analysis_Tool

KAI_Analysis_Tool supports high-speed analysis of trillion-record-scale data, wafer map visualization, correlation analysis, and anomaly detection using control charts across wafer tests (WT) and final tests (FT).

Consultation / Request Materials View Diagram Gallery
  • Reduce analysis time from hours to minutes
  • Native support for Lot / Wafer / Site structures
  • Supports STDF, CSV, and JSON measurement data
Overview of semiconductor test systems, MES, analysis server, and clients

Value

Yield improvement, quality enhancement, and early anomaly detection in one analysis platform

Analyze distributions, spatial trends, time-series drift, and correlations in semiconductor test data to quickly identify defect factors and support process feedback.

50〜90% Reduction in analysis time *Depends on environment and product
30〜70% Reduction in engineering workload *Depends on environment and product
Trillion-record scale Designed for big data analysis
WT / FT Supports both wafer tests and final tests

Architecture

System architecture connecting collection, storage, analysis, and visualization

KAI_Analysis_Server_System collects data from testers, probers, handlers, and upstream systems, then performs preprocessing and database storage. The client reads data from the database or directly from files such as STDF, then performs analysis and visualization.

Learn more about system architecture and data flow
Data flow between KAI_Analysis_Server_System and Client

Features

Feature Details

01

Basic Statistics and Correlation Analysis

Explore defect factors from distributions, outliers, and correlations between test items.

 02

Wafer Map and Area Segmentation

Intuitively identify local anomalies and spatial distribution bias on the wafer.

 03

Control Charts and Anomaly Detection

Detect process drift and equipment anomalies early using Xbar-R, EWMA, and CUSUM.

 04

STDF/CSV/JSON and Large-Scale Data

Handle large volumes of measurement data with MySQL 256-sharding and parallel processing.

 05

Use Cases and Implementation Benefits

Useful for yield degradation analysis, equipment anomaly detection, and new product ramp-up.

 06

Diagram Gallery

Browse key diagrams and screen images used in product materials.

Workflow

Root Cause Analysis Flow for Yield Degradation

Start from lot-level yield review, then proceed to wafer maps, area segmentation, and correlation analysis before feeding insights back to processes and equipment.

  1. 1Check yield at the lot level
  2. 2Visualize spatial distribution with wafer maps
  3. 3Identify local anomalies with area segmentation
  4. 4Extract influential parameters using correlation analysis
  5. 5Feed insights back to processes and equipment
Correlation analysis: identify outliers using specification limits and scatter plots
Category map and value map: understand chip-level trends on the wafer

FAQ

FAQ

Which test data formats are supported?

STDF, CSV, and JSON measurement data are supported. Other formats can also be supported through customization.

Can wafer tests and final tests be analyzed together?

Yes. WT and FT data can be analyzed and visualized across Lot / Wafer / Site structures.

What methods are used for anomaly detection?

Z-score, IQR, EWMA, CUSUM, wafer map spatial distribution bias, and correlation outlier detection can be combined.

Contact

Start a consultation for semiconductor test data analysis

Please contact us about existing STDF/CSV file analysis, database integration, report automation, alert operations, and other implementation options.

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